The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
May. 02, 2012
Hiroaki Sato, Kanagawa, JP;
Teck-gyu Kang, San Jose, CA (US);
Belgacem Haba, San Jose, CA (US);
Philip R. Osborn, San Jose, CA (US);
Wei-shun Wang, Palo Alto, CA (US);
Ellis Chau, San Jose, CA (US);
Ilyas Mohammed, San Jose, CA (US);
Norihito Masuda, Kanagawa, JP;
Kazuo Sakuma, Iwaki, JP;
Kiyoaki Hashimoto, Kanagawa, JP;
Kurosawa Inetaro, Saitma, JP;
Tomoyuki Kikuchi, Tokyo, JP;
Hiroaki Sato, Kanagawa, JP;
Teck-Gyu Kang, San Jose, CA (US);
Belgacem Haba, San Jose, CA (US);
Philip R. Osborn, San Jose, CA (US);
Wei-Shun Wang, Palo Alto, CA (US);
Ellis Chau, San Jose, CA (US);
Ilyas Mohammed, San Jose, CA (US);
Norihito Masuda, Kanagawa, JP;
Kazuo Sakuma, Iwaki, JP;
Kiyoaki Hashimoto, Kanagawa, JP;
Kurosawa Inetaro, Saitma, JP;
Tomoyuki Kikuchi, Tokyo, JP;
Tessera, Inc., San Jose, CA (US);
Abstract
A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.