Ellis Chau

Title: Discovering the Innovations of Ellis Chau

Introduction

Ellis Chau, an accomplished inventor based in San Jose, CA, holds an impressive portfolio of 39 patents. His expertise lies in the microelectronic packaging field, where he has made significant contributions through innovative designs and technologies that enhance the performance and efficiency of microelectronic assemblies.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Package-on-package assembly with wire bond vias." This innovation details a microelectronic package featuring a substrate with a first surface, where a microelectronic element is strategically positioned. The incorporation of electrically conductive elements at the substrate's first surface facilitates the connection of wire bonds, providing a compact and reliable assembly. The wire bonds, with defined tips smaller than their first diameters, offer enhanced performance while ensuring parts of the wire bonds remain uncovered by the dielectric encapsulation layer.

Another notable patent by Chau is “Package-on-package assembly with wire bonds to encapsulation surface.” This apparatus highlights a substrate equipped with first contacts that connect to a microelectronic die through strategically placed wire bonds. The design features a dielectric layer positioned above the substrate's upper surface, optimizing the connectivity and reliability between the components. These innovations not only advance microelectronic assembly technologies but also pave the way for future developments in the industry.

Career Highlights

Ellis Chau has contributed to pioneering technologies at notable companies, such as Adeia Semiconductor and Nan Chang O-film Optoelectronics Technology Ltd. His work in these organizations has revolved around advancing microelectronic packaging solutions, helping to bring innovative products to market and improving existing technologies to meet the industry's demands.

Collaborations

Throughout his career, Chau has collaborated with talented professionals, including Belgacem Haba and Ilyas Mohammed. These partnerships have enabled him to leverage diverse expertise and perspectives, further enhancing the innovation process and leading to significant advancements in microelectronic packaging.

Conclusion

With 39 patents to his name, Ellis Chau stands as a prominent figure in the realm of microelectronic innovations. His pioneering work continues to influence the industry, exemplifying the spirit of advancement and the importance of collaboration among inventors and engineers. The technologies he has developed serve as a foundation for the ongoing evolution of microelectronic assemblies, paving the way for future innovations in the field.