Yokohama, Japan

Norihito Masuda

USPTO Granted Patents = 19 

Average Co-Inventor Count = 7.0

ph-index = 6

Forward Citations = 326(Granted Patents)


Location History:

  • Tokyo, JP (2011 - 2014)
  • Kanagawa, JP (2013 - 2015)
  • Yokohama, JP (2013 - 2023)

Company Filing History:


Years Active: 2011-2023

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19 patents (USPTO):Explore Patents

Title: Norihito Masuda: Innovating Microelectronic Packaging with Patented Solutions

Introduction:

In the rapidly advancing world of microelectronics, individuals like Norihito Masuda play a pivotal role in shaping the future. Hailing from Yokohama, Japan, Masuda is renowned for his technical prowess and has made significant contributions to the field of microelectronic packaging. This article will delve into Masuda's latest patents, career highlights, and collaborations in Tessera, Inc., where he currently works.

Latest Patents:

Masuda's expertise in microelectronic package assembly is evident in his recent patents. One notable invention is the "Package-on-package assembly with wire bonds to encapsulation surface." This patent details innovative apparatuses related to microelectronic packages. The invention involves a substrate with first contacts and a microelectronic die with second contacts. Wire bonds are interconnected between the first and second contacts, with a dielectric layer and bent wire bonds enhancing the package's functionality and efficiency.

Career Highlights:

Norihito Masuda's career is marked by numerous achievements and contributions to the microelectronics industry. With an impressive count of 17 patents, he has continually pushed the boundaries of innovation. His work has been instrumental in developing advanced packaging technologies, ensuring smaller form factors, improved performance, and enhanced reliability for microelectronic devices.

Collaborations:

Masuda's collaborations with fellow experts have further enriched his contributions to the field. Two noteworthy coworkers at Tessera, Inc. are Hiroaki Sato and Belgacem Haba. Together, they form a formidable team, leveraging their collective expertise to drive innovation in microelectronics packaging. These collaborative efforts have resulted in groundbreaking inventions, contributing to the success of Tessera and the larger microelectronics community.

Conclusion:

Norihito Masuda's impact on microelectronic packaging innovation cannot be overstated. Through his extensive patent portfolio and collaborative work at Tessera, Inc., Masuda has established himself as a leading figure in the field. His inventions have revolutionized microelectronic package assembly, enabling advancements in various industries reliant on miniaturized and high-performance electronic devices. As Masuda continues to drive technological innovation, the industry eagerly anticipates his future contributions.

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