The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Apr. 12, 2011
Applicants:
Kimitaka Endo, Tokyo, JP;
Norihito Masuda, Tokyo, JP;
Tomokazu Shimada, Tokyo, JP;
Inventors:
Assignee:
Invensas Corporation, San Jose, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H05K 3/20 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4617 (2013.01); H05K 3/205 (2013.01); H05K 3/423 (2013.01); H05K 2203/0384 (2013.01); H01L 23/49822 (2013.01); H05K 2203/0542 (2013.01); H04K 2203/0733 (2013.01); H01L 23/5383 (2013.01); H05K 3/4647 (2013.01); H01L 21/4857 (2013.01); H05K 3/064 (2013.01); Y10S 438/931 (2013.01);
Abstract
A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.