Location History:
- Yokohama, JP (2013 - 2016)
- Kanagawa, JP (2013 - 2023)
Company Filing History:
Years Active: 2013-2023
Title: Kiyoaki Hashimoto: Innovator in Microelectronic Packaging
Introduction
Kiyoaki Hashimoto is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of microelectronics, particularly in the area of packaging technologies. With a total of 14 patents to his name, Hashimoto continues to push the boundaries of innovation in semiconductor bonding.
Latest Patents
One of Hashimoto's latest patents is focused on a package-on-package assembly with wire bonds to encapsulation surfaces. This invention discloses apparatuses relating to a microelectronic package. In this apparatus, a substrate features first contacts on its upper surface. A microelectronic die is positioned with its lower surface facing the substrate's upper surface, which contains second contacts. Wire bonds are utilized, with bases joined to the first contacts and edge surfaces positioned between the bases and corresponding end surfaces. A portion of these wire bonds interconnects the first contacts and the second contacts. Additionally, the end surfaces of another portion of the wire bonds are located above the upper surface of the microelectronic die. A dielectric layer is situated above the substrate's upper surface and between the wire bonds, with the uppermost portions of the second wire bonds bent over to align parallel with the dielectric layer's upper surface.
Career Highlights
Hashimoto is currently associated with Adeia Semiconductor Bonding Technologies Inc., where he applies his expertise in microelectronic packaging. His work has been instrumental in advancing the technology used in semiconductor devices, making them more efficient and reliable.
Collaborations
Throughout his career, Hashimoto has collaborated with notable professionals in the field, including Hiroaki Sato and Belgacem Haba. These collaborations have further enriched his contributions to microelectronic innovations.
Conclusion
Kiyoaki Hashimoto stands out as a key figure in the realm of microelectronic packaging. His innovative patents and collaborations reflect his commitment to advancing technology in this critical field. His work continues to influence the future of semiconductor bonding technologies.
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