Wei-Shun Wang

Title: Innovations and Patents of Wei-Shun Wang in Microelectronics

Introduction

Wei-Shun Wang is an accomplished inventor based in Palo Alto, CA, with a notable portfolio comprising 25 patents in the field of microelectronics. His work significantly contributes to advancements in packaging technologies, particularly in the integration and assembly of microelectronic components.

Latest Patents

Wang’s latest patents showcase innovative solutions for microelectronic packaging. One of his inventions, "Package-on-package assembly with wire bond vias," describes a microelectronic package that includes a substrate with a microelectronic element. This patent outlines the intricate structure of wire bonds that are connected to conductive elements on the substrate, emphasizing the use of dielectric encapsulation layers for protecting portions of the wire bonds.

Another notable patent, "Package-on-package assembly with wire bonds to encapsulation surface," details an apparatus where wire bonds connect a microelectronic die to a substrate. This invention highlights the unique design of wire bonds that are bent over parallel to the upper surface of a dielectric layer, which enhances the efficiency of microelectronic assemblies.

Career Highlights

Throughout his career, Wei-Shun Wang has worked with leading companies in the semiconductor industry. He has been associated with Adeia Semiconductor Bonding Technologies Inc. and Avago Technologies International Sales Pte. Limited. His roles in these organizations have centered around research and development, focusing on groundbreaking innovations in microelectronic packaging.

Collaborations

Wang's work has fostered collaboration with esteemed colleagues, including Ellis Chau and Belgacem Haba. These partnerships have allowed him to combine expertise and drive advancements in the field of microelectronics, leading to the development of valuable patents that address industry challenges.

Conclusion

Wei-Shun Wang's contributions to the microelectronics sector are underscored by his extensive patent portfolio and collaborative efforts within the industry. His innovative designs in package assembly continue to push the boundaries of technology, making significant impacts on how microelectronic devices are developed and integrated.