Tomoyuki Kikuchi

Title: The Innovations of Tomoyuki Kikuchi

Introduction

Tomoyuki Kikuchi is a prominent inventor based in Kanagawa, Japan. He has made significant contributions to the field of microelectronics, holding a total of 10 patents. His work focuses on advanced packaging technologies that enhance the performance and reliability of microelectronic devices.

Latest Patents

One of Kikuchi's latest patents is for a package-on-package assembly with wire bonds to encapsulation surface. This invention discloses apparatuses relating to a microelectronic package. In this apparatus, a substrate features first contacts on its upper surface. A microelectronic die is positioned with its lower surface facing the substrate, having second contacts on its upper surface. Wire bonds connect the first contacts to the second contacts, with a portion of the wire bonds bent over to be parallel with a dielectric layer above the substrate. This innovative design improves the efficiency and functionality of microelectronic packages.

Career Highlights

Throughout his career, Kikuchi has worked with notable companies such as Adeia Semiconductor Bonding Technologies Inc. and Fujifilm Corporation. His experience in these organizations has allowed him to develop and refine his expertise in microelectronic packaging technologies.

Collaborations

Kikuchi has collaborated with talented individuals in the field, including Hiroaki Sato and Teck-Gyu Kang. These partnerships have contributed to the advancement of his innovative projects and patents.

Conclusion

Tomoyuki Kikuchi's contributions to microelectronics through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the development of advanced packaging technologies, ensuring the ongoing evolution of microelectronic devices.