Kanagawa, Japan

Kurosawa Inetaro

USPTO Granted Patents = 9 

Average Co-Inventor Count = 12.0

ph-index = 4

Forward Citations = 265(Granted Patents)


Location History:

  • Saitma, JP (2013)
  • Kanagawa, JP (2015 - 2023)

Company Filing History:


Years Active: 2013-2023

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9 patents (USPTO):Explore Patents

Title: The Innovative Spirit of Kurosawa Inetaro: A Trailblazer in Technology

Introduction: Kurosawa Inetaro, a visionary inventor based in Kanagawa, JP, has made significant contributions to the world of innovation with his relentless drive and inventive spirit.

Latest Patents: Inetaro has recently patented a groundbreaking technology called "Package-on-package assembly with wire bonds to encapsulation surface." This technology involves a microelectronic package where wire bonds are interconnected between contacts on a substrate and a microelectronic die, creating a unique assembly with dielectric layers for enhanced functionality.

Career Highlights: With a total of nine patents to his name, Inetaro has established himself as a pioneer in the field of technology. His innovative approach to microelectronic packaging has paved the way for advancements in the industry, showcasing his expertise and creativity.

Collaborations: Inetaro collaborates closely with his coworkers Hiroaki Sato and Teck-Gyu Kang at Adeia Semiconductor Bonding Technologies Inc. Their combined expertise and teamwork have led to the successful development and implementation of cutting-edge technologies in the semiconductor industry.

Conclusion: In conclusion, Kurosawa Inetaro's dedication to innovation and his groundbreaking inventions have solidified his reputation as a trailblazer in technology. His contributions to the field will continue to inspire future generations of inventors and push the boundaries of what is possible in the world of technology.

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