San Jose, CA, United States of America

Philip R Osborn

USPTO Granted Patents = 19 

Average Co-Inventor Count = 5.6

ph-index = 6

Forward Citations = 394(Granted Patents)


Location History:

  • Mountain View, CA (US) (2001 - 2006)
  • San Jose, CA (US) (2007 - 2023)

Company Filing History:


Years Active: 2001-2023

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19 patents (USPTO):Explore Patents

Title: Philip R Osborn: Innovating Microelectronic Packaging Solutions

Introduction

Philip R Osborn is a prolific inventor based in San Jose, CA, known for his significant contributions to the field of microelectronics. With a remarkable portfolio of 19 patents, he has been at the forefront of innovation, particularly in packaging technologies that enhance the performance and reliability of microelectronic devices.

Latest Patents

One of his latest patents is related to the "Package-on-package assembly with wire bonds to encapsulation surface." This invention discloses an apparatus pertaining to a microelectronic package. The apparatus features a substrate with first contacts on its upper surface and a microelectronic die with second contacts on its upper surface. The innovation involves wire bonds that connect these contacts, where a first portion interconnects the first and second contacts, while a second portion is positioned above the microelectronic die. Additionally, the design includes a dielectric layer above the substrate, enhancing the structural integrity and functionality of the assembly.

Career Highlights

Currently, Philip R Osborn works with Adeia Semiconductor Bonding Technologies Inc., where he continues to develop groundbreaking solutions in microelectronic packaging. His expertise not only contributes to his company's growth but also plays a vital role in advancing the semiconductor industry.

Collaborations

Throughout his career, Philip has collaborated with notable colleagues, including Belgacem Haba and Ilyas Mohammed. These partnerships have facilitated the exchange of ideas and fostered a culture of innovation within their team, leading to the successful development of various patents.

Conclusion

Philip R Osborn's extensive patent portfolio and his role at Adeia Semiconductor Bonding Technologies Inc. underscore his impact on microelectronic innovations. With ongoing collaborations and a commitment to advancing technology, he continues to shape the future of electronic packaging solutions.

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