San Jose, CA, United States of America

Teck-Gyu Kang

This inventor holds 43 USPTO granted patents and 2 published patent applications, primarily in Microelectronic Packaging. Top assignees: Adeia Semiconductor Bonding Technologies Inc., Altera Corporation, Adeia Semiconductor Solutions LLC. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teck-Gyu Kang. Retrieved from https://idiyas.com/inventor/teck-gyu-kang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 43 

% Patents Active = 69.8

Average Co-Inventor Count = 3.7

ph-index = 20

Forward Citations = 1,677(Granted Patents)


Company Filing History:


Years Active: 2006-2025

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Areas of Expertise:
Microelectronic Packages
Package-On-Package Assembly
Semiconductor Chip Assembly
Wafer Level Chip Package
Flip Chip Overmold Package
Fine Pitch Microcontacts
Connection Components
Solid State Lighting Device
Image Sensor Package
High-Frequency Chip Packages
Micro Pin Grid Array
Flexible Microelectronic Assembly
43 patents (USPTO):Explore Patents

Title: Teck-Gyu Kang: Pioneering Innovations in Microelectronic Packages

Introduction

Teck-Gyu Kang, based in San Jose, CA, is a prolific inventor known for his significant contributions to the field of microelectronic packaging. With a total of 42 patents to his name, Kang has continually pushed the boundaries of technology, particularly in the design and functionality of electronic components.

Latest Patents

Among his notable inventions, Teck-Gyu Kang's recent patent focuses on "Package-on-package assembly with wire bonds to encapsulation surface." This innovative apparatus allows for a refined microelectronic package, featuring a substrate with first contacts on its upper surface. A microelectronic die, facing the substrate, is equipped with second contacts. Notably, wire bonds are utilized, linking the first and second contacts in a unique configuration. This design includes a dielectric layer interspersed between the wire bonds, enhancing the overall performance and reliability of the package.

Career Highlights

Throughout his career, Teck-Gyu Kang has held pivotal roles at various esteemed companies, including Adeia Semiconductor and Altera Corporation. His expertise in semiconductor bonding technologies has led to advancements that streamline the manufacturing process and boost the efficiency of microelectronic devices.

Collaborations

Kang has had the opportunity to collaborate with several talented individuals in the industry, notably Belgacem Haba and Ilyas Mohammed. These collaborations have facilitated innovative solutions and further fostered the dynamic exchange of ideas within the field.

Conclusion

Teck-Gyu Kang stands out as a prominent inventor in the realm of microelectronics. His continued focus on advancing packaging technologies not only reflects his dedication to the field but also highlights the potential for future innovations that can shape the electronic landscape. His contributions, encapsulated in numerous patents, serve as a testament to his commitment to excellence in engineering and invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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