The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Mar. 08, 2013
Applicant:
Altera Corporation, San Jose, CA (US);
Inventor:
Teck-Gyu Kang, San Jose, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/165 (2013.01); H01L 25/50 (2013.01);
Abstract
An integrated circuit (IC) package having a packaging substrate, an IC disposed onto the packaging substrate, and a rigid support member attached to the substrate layer through an adhesive spacer is provided. The packaging substrate includes multiple decoupling capacitors positioned thereon around the IC. A heat sink is placed over the IC. The rigid support member provides enhanced structural support for the IC packaging and there is ample space between a bottom surface of the rigid support member and the packaging substrate to allow the placement of the decoupling capacitors underneath the rigid support member.