The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Aug. 09, 2005
Jingbin Feng, Lake Oswego, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Daniel Mark Dinneen, Portland, OR (US);
Edmund B. Minshall, Sherwood, OR (US);
Christopher M. Bartlett, Beaverton, OR (US);
Eric G. Webb, West Linn, OR (US);
R. Marshall Stowell, Wilsonville, OR (US);
Mark T. Winslow, Camas, WA (US);
Avishai Kepten, Lake Oswego, OR (US);
Norman D. Kaplan, Portland, OR (US);
Richard K. Lyons, Sandy, OR (US);
John B. Alexy, West Linn, OR (US);
Jingbin Feng, Lake Oswego, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Daniel Mark Dinneen, Portland, OR (US);
Edmund B. Minshall, Sherwood, OR (US);
Christopher M. Bartlett, Beaverton, OR (US);
Eric G. Webb, West Linn, OR (US);
R. Marshall Stowell, Wilsonville, OR (US);
Mark T. Winslow, Camas, WA (US);
Avishai Kepten, Lake Oswego, OR (US);
Norman D. Kaplan, Portland, OR (US);
Richard K. Lyons, Sandy, OR (US);
John B. Alexy, West Linn, OR (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
During fluid treatment of a substrate surface, a carrier/wafer assembly containing a substrate wafer closes the top of a microcell container. The carrier/wafer assembly and the container walls define a thin enclosed treatment volume that is filled with treating fluid, such as electroless plating solution. The thin fluid-treatment volume typically has a volume in a range of about from 100 ml to 500 ml. Preferably a container is heated and the treating fluid is pre-heated before being injected into the container. Preferably, the chemical composition, temperature, and other properties of fluid in the thin enclosed fluid-treatment volume are dynamically variable. A rinse shield and a rinse nozzle are located above the container. A carrier/wafer assembly in a rinse position substantially closes the top of the rinse shield.