Lake Oswego, OR, United States of America

Jingbin Feng

This inventor holds 34 USPTO granted patents and 1 published patent application, primarily in Electroplating Technology. Top assignees: Novellus Systems Incorporated, Lam Research Corporation, International Business Machines Corporation. Active years: 2000-2026.

USPTO Granted Patents = 34 

% Patents Active = 91.2

Average Co-Inventor Count = 4.2

ph-index = 11

Forward Citations = 465(Granted Patents)


Location History:

  • Tigard, OR (US) (2000 - 2001)
  • Lake Oswego, OR (US) (2004 - 2022)
  • Ridgefield, WA (US) (2024)

Company Filing History:


Years Active: 2000-2026

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Areas of Expertise:
Electroplating
Wettability
Electrolyte Concentration
Semiconductor
Plating Apparatus
Flow Dynamics
Anode Design
Magnetically Actuated Chuck
Edge Bevel Removal
Electroless Plating
Wafer Chuck
Heat Management
34 patents (USPTO):Explore Patents

Title: **Jingbin Feng - Innovator in Semiconductor Technologies**

Introduction

Jingbin Feng is an accomplished inventor based in Lake Oswego, Oregon, with an impressive record of 32 patents to his name. His innovations primarily focus on improving electroplating apparatuses used in semiconductor manufacturing. With a solid background in the field, Jingbin has contributed significantly to advancing technology in this critical sector.

Latest Patents

Jingbin Feng's latest patents include groundbreaking technologies such as "Lipseals and contact elements for semiconductor electroplating apparatuses." This invention discloses cup assemblies that hold, seal, and provide electrical power to semiconductor substrates during electroplating. Notably, the cup bottom element features a main body that resists flexing under pressure, along with an elastomeric sealing element integrated during manufacturing. The innovative design enhances the efficiency and reliability of electroplating processes.

Another significant patent outlines "Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates." The patented method includes a comprehensive approach to manage electrolyte concentration during the electroplating of metals onto semiconductor substrates, ensuring performance consistency and quality.

Career Highlights

Throughout his career, Jingbin has made impactful contributions while working with notable companies in the semiconductor industry. His experience at Novellus Systems Incorporated and Lam Research Corporation has allowed him to develop and refine technologies that have shaped current manufacturing practices in semiconductors.

Collaborations

Jingbin has collaborated with talented individuals such as Zhian He and Shantinath Ghongadi. Their teamwork has facilitated the exchange of innovative ideas and led to the successful development of multiple patents that address challenges in the semiconductor industry.

Conclusion

Jingbin Feng's contributions to semiconductor technology through his numerous patents demonstrate his commitment to innovation. With his expertise and collaborative spirit, he continues to influence the future of electroplating and semiconductor manufacturing, marking him as a prominent figure in the field.

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