The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
Nov. 01, 2018
Lam Research Corporation, Fremont, CA (US);
Zhian He, Lake Oswego, OR (US);
Shantinath Ghongadi, Tigard, OR (US);
Quan Ma, Tigard, OR (US);
Hyungjun Hur, Tigard, OR (US);
Cian Sweeney, Portland, OR (US);
Quang Nguyen, Tigard, OR (US);
Rezaul Karim, Gilbert, AZ (US);
Jingbin Feng, Lake Oswego, OR (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.