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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9945044 B1

PDFFull Text
Date of Patent:
Apr. 17, 2018

Filed:

Nov. 06, 2013

Method for uniform flow behavior in an electroplating cell

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Daniel Mark Dinneen, Tigard, OR (US);

Jingbin Feng, Lake Oswego, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Harry D Wilkins, Iii

Int. Cl.
CPC ...
C25D 17/00 (2006.01); H01L 21/67 (2006.01); C25D 21/10 (2006.01); C25D 7/12 (2006.01); C25D 5/08 (2006.01); C25D 17/06 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); C25D 5/08 (2013.01); C25D 7/123 (2013.01); C25D 17/002 (2013.01); C25D 17/06 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01); H01L 21/67 (2013.01); H01L 21/6723 (2013.01);
Abstract

Apparatuses and methods are provided for depositing a metal layer on a wafer. A secondary weir is positioned at a region below the primary weir such that overflowed plating solution over the primary weir during electroplating flows in a substantially azimuthally uniform manner. Methods are provided for electroplating wafers by increasing flow rate between wafer processes while plating solution flows over a primary weir, remains in contact with the overflowing plating solution, and flows onto the secondary weir such that overflow is substantially azimuthally uniform.

Find Patent Forward Citations

Dinneen, Daniel. (2018). Method for uniform flow behavior in an electroplating cell (U.S. Patent No. 9945044). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9945044

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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