Daniel Mark Dinneen

Title: The Innovative Contributions of Daniel Mark Dinneen

Introduction

Daniel Mark Dinneen is a notable inventor based in Tigard, OR (US). He has made significant contributions to the field of electroplating, holding a total of 8 patents. His work focuses on improving the efficiency and effectiveness of metal layer deposition on wafers.

Latest Patents

Dinneen's latest patents include innovative methods and apparatuses for electroplating. One of his key inventions is related to uniform flow behavior in an electroplating cell. This patent describes apparatuses and methods for depositing a metal layer on a wafer, featuring a secondary weir positioned below the primary weir. This design allows for a substantially azimuthally uniform flow of the plating solution during the electroplating process. Another significant patent involves methods for electroplating and seed layer detection. This method employs seed layer detection by selecting a wafer, illuminating points on its surface, and measuring color signals to determine the presence of an acceptable seed layer.

Career Highlights

Throughout his career, Dinneen has worked with prominent companies in the semiconductor industry, including Lam Research Corporation and Novellus Systems Incorporated. His experience in these organizations has contributed to his expertise in electroplating technologies.

Collaborations

Dinneen has collaborated with notable professionals in his field, including Steven T Mayer and Jingbin Feng. These collaborations have likely enhanced his innovative capabilities and contributed to the development of his patents.

Conclusion

Daniel Mark Dinneen's contributions to the field of electroplating through his patents and career experiences highlight his role as a significant inventor. His work continues to influence advancements in semiconductor manufacturing processes.