Lake Oswego, OR, United States of America

Avishai Kepten


Average Co-Inventor Count = 6.3

ph-index = 8

Forward Citations = 143(Granted Patents)


Company Filing History:


Years Active: 2009-2014

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11 patents (USPTO):

Title: Avishai Kepten: Innovator in Electrochemical Plating Technologies

Introduction

Avishai Kepten is a prominent inventor based in Lake Oswego, OR (US). He has made significant contributions to the field of electrochemical plating, holding a total of 11 patents. His innovative work focuses on methods and apparatus for enhancing metal plating processes, particularly in complex surface topographies.

Latest Patents

Among his latest patents, Avishai has developed methods for selective electrochemical accelerator removal. This invention provides a technique for planar metal plating on workpieces with surfaces that have both recessed and exposed regions. The process involves attaching a plating accelerator to the surface and selectively removing it from the exposed regions, which enhances the rate of metal plating in the recessed areas. Another notable patent addresses topography reduction and control by selective accelerator removal. This method allows for the selective application of plating accelerators to wide feature cavities, ensuring improved planarization and protection of metal interconnects.

Career Highlights

Avishai Kepten is currently associated with Novellus Systems Incorporated, where he continues to innovate in the field of electrochemical technologies. His work has been instrumental in advancing the capabilities of metal plating processes, making them more efficient and effective.

Collaborations

Throughout his career, Avishai has collaborated with notable colleagues, including Steven T Mayer and R Marshall Stowell. These partnerships have contributed to the development of cutting-edge technologies in the industry.

Conclusion

Avishai Kepten's contributions to electrochemical plating technologies have established him as a leading inventor in his field. His innovative patents and collaborative efforts continue to shape the future of metal plating processes.

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