Location History:
- Fremont, CA (US) (2011 - 2018)
- San Jose, CA (US) (2021 - 2023)
Company Filing History:
Years Active: 2011-2024
Title: The Innovations of Zheng Zeng
Introduction
Zheng Zeng is a prominent inventor based in Fremont, CA, known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, he has made remarkable advancements in the field, particularly in semiconductor package structures.
Latest Patents
Zheng Zeng's latest patents include a semiconductor package structure that features a frontside redistribution layer and a stacking structure containing both a first and a second semiconductor die. This innovative design incorporates a backside redistribution layer and two intellectual property (IP) cores, each electrically coupled through distinct routing channels. Another notable patent is for a semiconductor package with a through-silicon via (TSV) inductor, which includes a first die with multiple TSVs and a second die stacked on top. This design also features an interposer layer with an inductor that connects directly to the TSVs, showcasing Zeng's expertise in enhancing semiconductor performance.
Career Highlights
Throughout his career, Zheng Zeng has worked with leading companies in the semiconductor industry, including MediaTek Corporation and MediaTek Singapore Pte. Ltd. His experience in these organizations has allowed him to develop cutting-edge technologies that have a lasting impact on the industry.
Collaborations
Zheng has collaborated with notable colleagues such as Ching-Chung Ko and Hsing-Chih Liu, contributing to various projects that have advanced semiconductor technology.
Conclusion
Zheng Zeng's innovative work in semiconductor packaging has established him as a key figure in the field. His patents reflect a deep understanding of technology and a commitment to advancing the industry.