Yung-I Yeh

This inventor holds 17 USPTO granted patents and 2 published patent applications. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 1999-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yung-I Yeh. Retrieved from https://idiyas.com/inventor/yung-i-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 (Patent Applications = 2)

% Patents Active = 88.2

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 199(Granted Patents)

Company Filing History:

17 out of 1,964

Advanced Semiconductor Engineering, Inc.

patents

Years Active: 1999-2026

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12572170 - Electronic device with removable electronic component modules (2026-03-10),

2. 12218077 - Semiconductor device package (2025-02-04),

3. 11997888 - Semiconductor device package and method of manufacturing the same (2024-05-28),

4. 11201200 - Semiconductor device package and method of manufacturing the same (2021-12-14),

5. 11081473 - Semiconductor device package and method of manufacturing the same (2021-08-03),

6. 9984983 - Semiconductor packages with thermal-enhanced conformal shielding and related methods (2018-05-29),

7. 9484313 - Semiconductor packages with thermal-enhanced conformal shielding and related methods (2016-11-01),

8. 8786060 - Semiconductor package integrated with conformal shield and antenna (2014-07-22),

9. 7375020 - Method of forming bumps (2008-05-20),

10. 6960822 - Solder mask and structure of a substrate (2005-11-01),

11. 6916732 - Method of forming bumps (2005-07-12),

12. 6795746 - System for providing IC bonding diagram via network (2004-09-21),

13. 6751781 - Thermal data automatic service system (2004-06-15),

14. 6528882 - Thermal enhanced ball grid array package (2003-03-04),

15. 6313413 - Wire structure of substrate for layout detection (2001-11-06),

Title: Yung-I Yeh: Innovator in Semiconductor Technology

Introduction

Yung-I Yeh is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His work focuses on innovative semiconductor device packages that enhance electronic component integration and performance.

Latest Patents

Yung-I Yeh's latest patents include a semiconductor device package that features a carrier, a first electronic component, and a support component. This design allows for a second electronic component to be supported effectively. Another notable patent is for a semiconductor device package and method of manufacturing, which incorporates a display device, an electronic module, and a conductive adhesion layer. This invention optimizes the arrangement of substrates and electronic components, improving overall functionality.

Career Highlights

Yung-I Yeh is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Yung-I Yeh has collaborated with notable colleagues such as Kun-Ching Chen and Chi-Sheng Chung, contributing to various projects that advance semiconductor technology.

Conclusion

Yung-I Yeh's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the development of advanced electronic devices.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: