The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2018
Filed:
Sep. 21, 2016
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Chi-Sheng Chung, Koahsiung, TW;
Kuo-Hsien Liao, Taichung, TW;
Jin-Feng Yang, Kaohsiung, TW;
Chen-Yin Tai, Chaozhuo Township, TW;
Yung-I Yeh, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.