Chen-Yin Tai

Title: Innovations of Chen-Yin Tai in Semiconductor Technology

Introduction

Chen-Yin Tai is a notable inventor based in Chaozhuo Township, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

Chen-Yin Tai's latest patents include innovative designs for semiconductor packages with thermal-enhanced conformal shielding. These patents describe a semiconductor package that consists of a substrate, a die, a first metal layer, a second metal layer, and an optional seed layer. The package body encapsulates the die on the substrate, while the seed layer is placed on the package body. The first metal layer is positioned on the seed layer, and the second metal layer is applied to both the first metal layer and the lateral surface of the substrate. This configuration allows the first and second metal layers to form an outer metal cap, which provides essential thermal dissipation and electromagnetic interference (EMI) shielding.

Career Highlights

Chen-Yin Tai is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His expertise in this area has led to advancements that improve the efficiency and functionality of electronic devices.

Collaborations

Throughout his career, Chen-Yin Tai has collaborated with talented individuals such as Chi-Sheng Chung and Kuo-Hsien Liao. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Chen-Yin Tai's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively, paving the way for future innovations.