Advanced Semiconductor Engineering, Inc.

Chen-Yin Tai

Kuo-Hsien Liao

Yung-I Yeh

Jin-Feng Yang

Chi-Sheng Chung

The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.

Growing community of inventors

Chaozhuo Township, Taiwan

Chen-Yin Tai