Location History:
- Nan-Tou, TW (2010)
- Taichung, TW (2007 - 2018)
- Kaohsiung, TW (2011 - 2024)
Company Filing History:
19 out of 1,884 
2 out of 75 
1 out of 79 Years Active: 2007-2024
Title: Kuo-Hsien Liao: A Pioneer in Semiconductor and Optical Device Packaging
Introduction
Kuo-Hsien Liao is a highly accomplished inventor based in Taichung, Taiwan, renowned for his contributions to semiconductor and optical device technologies. With an impressive portfolio of 22 patents, Liao has significantly advanced the field, particularly in device packaging and fabrication methods.
Latest Patents
Kuo-Hsien Liao’s latest innovations include two notable patents. The first patent is for a semiconductor device package, which discloses a unique construction method. This package comprises a substrate with a first face mounted with a first semiconductor component and multiple connectors. A first shielding member covers both the component and a group of the connectors, ensuring optimal functionality while exposing another group of connectors.
The second patent centers on an optical device package and its manufacturing method. This innovative package features a substrate, a light emitting device, and a light detecting device, with one or more electronic chips embedded within the substrate. Notably, the package also includes a clear encapsulation layer and a patterned reflective layer designed to enhance performance by strategically overlapping the gap between the light emitting and detecting devices.
Career Highlights
Throughout his career, Kuo-Hsien Liao has made significant contributions while working for esteemed companies in the semiconductor industry. Notably, he has held positions at Advanced Semiconductor Engineering, Inc. and Universal Scientific Industrial Co., Ltd., where he has been instrumental in driving innovation and development in semiconductor technologies.
Collaborations
Liao has had the opportunity to work closely with talented individuals in the industry, including his coworkers Chi-Tsung Chiu and Chi-Sheng Chung. These collaborations have further enriched his work, exemplifying the importance of teamwork in technological advancements.
Conclusion
Kuo-Hsien Liao stands out as a prominent figure in semiconductor and optical device innovations. His 22 patents reflect his dedication and expertise in the field, laying a foundation for future technological advancements and influencing the direction of research and development in device packaging.