The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

Aug. 08, 2011
Applicants:

Kuo-hsien Liao, TaiChung, TW;

Chi-hong Chan, Hong Kong, HK;

Shih Fuyu, Benitachell, ES;

Inventors:

Kuo-Hsien Liao, TaiChung, TW;

Chi-Hong Chan, Hong Kong, HK;

Shih Fuyu, Benitachell, ES;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01L 23/48 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01Q 1/22 (2006.01); H01L 23/055 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/055 (2013.01); H01L 23/295 (2013.01); H01L 23/481 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H01L 25/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81 (2013.01); H01L 2224/85 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H01Q 1/526 (2013.01); Y10T 29/41 (2015.01);
Abstract

A semiconductor package integrated with conformal shield and antenna is provided. The semiconductor package includes a semiconductor element, an electromagnetic interference shielding element, a dielectric structure, an antenna element and an antenna signal feeding element. The electromagnetic interference shielding element includes an electromagnetic interference shielding film and a grounding element, wherein the electromagnetic interference shielding film covers the semiconductor element and the grounding element is electrically connected to the electromagnetic interference shielding layer and a grounding segment of the semiconductor element. The dielectric structure covers a part of the electromagnetic interference shielding element and has an upper surface. The antenna element is formed adjacent to the upper surface of the dielectric structure. The antenna signal feeding element passing through the dielectric structure electrically connects the antenna element and the semiconductor element.


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