The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
May. 04, 2012
Han-chee Yen, Taipei, TW;
Chi-sheng Chung, Kaohsiung, TW;
Kuo-hsien Liao, Taichung, TW;
Yung-i Yeh, Kaohsiung, TW;
Han-Chee Yen, Taipei, TW;
Chi-Sheng Chung, Kaohsiung, TW;
Kuo-Hsien Liao, Taichung, TW;
Yung-I Yeh, Kaohsiung, TW;
Abstract
A semiconductor package includes a substrate, a semiconductor die, a package body, an electromagnetic interference shield, a dielectric structure and an antenna element. The substrate comprises a grounding segment and a feeding point. The semiconductor die is disposed on the substrate. The package body encapsulates the semiconductor die. The electromagnetic interference shield is formed on the package body. The dielectric structure encapsulates the electromagnetic interference shield. The antenna element is formed on the dielectric structure and electrically connecting the grounding segment of the substrate and the feeding point.