Location History:
- Kaohsiung, TW (2014 - 2016)
- Koahsiung, TW (2018)
Company Filing History:
Years Active: 2014-2018
Title: Chi-Sheng Chung: Innovator in Semiconductor Technology
Introduction
Chi-Sheng Chung is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.
Latest Patents
One of Chi-Sheng Chung's latest patents is for semiconductor packages with thermal-enhanced conformal shielding and related methods. This innovative semiconductor package includes a substrate, a die, a first metal layer, a second metal layer, and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body, and the first metal layer is placed on the seed layer. The second metal layer is positioned on the first metal layer and the lateral surface of the substrate. Together, the first and second metal layers form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.
Career Highlights
Chi-Sheng Chung is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technology. His expertise and dedication have made him a valuable asset to the company.
Collaborations
Chi-Sheng Chung has collaborated with notable colleagues, including Kuo-Hsien Liao and Yung-I Yeh, contributing to advancements in their field.
Conclusion
Chi-Sheng Chung's work in semiconductor technology exemplifies innovation and dedication. His patents reflect a commitment to improving the efficiency and effectiveness of semiconductor packages.