The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Nov. 25, 2019
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Chanyuan Liu, Kaohsiung, TW;
Han-Chee Yen, Kaohsiung, TW;
Kuo-Hsien Liao, Kaohsiung, TW;
Alex Chi-Hong Chan, Kaohsiung, TW;
Christophe Zinck, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor package structure includes a substrate structure having a first surface and a second surface opposite to the first surface; at least two electronic components electrically connected to the first surface of the substrate structure; at least one shielding pad disposed on the first surface of the substrate structure; a plurality of vias connected to the at least one shielding pad; a plurality of shielding wirebonds disposed between the electronic components. Each of the shielding wirebonds includes a first bond and a second bond opposite to the first bond, the first bond and the second bond being electrically connected to the at least one shielding pad, and the vias being free from overlapping with any of the plurality of vias.