Chanyuan Liu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on innovative semiconductor device packages and methods of manufacturing them.

Latest Patents

One of Liu's latest patents is titled "Semiconductor device package and method of manufacturing the same." This invention includes a substrate with a first surface, a second surface opposite to the first surface, and a plurality of lateral surfaces extending between them. The substrate defines both a first and a second opening that expose the lateral surfaces. The monolithic encapsulant consists of a first portion on the first surface, a second portion on the second surface, and a third portion within the openings. Another notable patent is simply titled "Semiconductor device package," which describes a semiconductor package comprising a substrate with a first face mounted with a semiconductor component and connectors, along with a shielding member that covers part of the components while exposing others.

Career Highlights

Chanyuan Liu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His innovative designs and methods have positioned him as a key player in the industry.

Collaborations

Liu has collaborated with notable colleagues such as Kuo-Hsien Liao and Alex Chi-Hong Chan, contributing to various projects that enhance semiconductor manufacturing processes.

Conclusion

Chanyuan Liu's work in semiconductor technology exemplifies innovation and dedication. His patents reflect a commitment to advancing the field, making him a significant figure in the industry.

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