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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10930802 B1

PDFFull Text
Date of Patent:
Feb. 23, 2021

Filed:

May. 03, 2018

Semiconductor device package and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventor:

Chanyuan Liu, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Ahmed N Sefer

Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 31/173 (2006.01); H01L 31/0232 (2014.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 23/3121 (2013.01); H01L 25/167 (2013.01); H01L 31/02002 (2013.01); H01L 31/0232 (2013.01); H01L 31/173 (2013.01); H01L 31/18 (2013.01);
Abstract

A semiconductor device package includes a substrate, a first encapsulant and a second encapsulant. The substrate has an optical region and a surface-mount technology (SMT) device region. The first encapsulant includes a first portion disposed on the optical region and covers the optical region and a second portion disposed on the SMT device region and covers the SMT device region. The second encapsulant is disposed on the substrate and covers at least a portion of the second portion of the first encapsulant and a portion of the first portion of the first encapsulant.

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Liu, Chanyuan. (2021). Semiconductor device package and method of manufacturing the same (U.S. Patent No. 10930802). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10930802

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