The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
May. 24, 2011
Kuo-hsien Liao, Taichung, TW;
Chi-hong Chan, Hong Kong, CN;
Jian-cheng Chen, Tainan, TW;
Chian-her Ueng, Chaozhou Township, Pingtung County, TW;
Yu-hsiang Sun, Kaohsiung, TW;
Kuo-Hsien Liao, Taichung, TW;
Chi-Hong Chan, Hong Kong, CN;
Jian-Cheng Chen, Tainan, TW;
Chian-Her Ueng, Chaozhou Township, Pingtung County, TW;
Yu-Hsiang Sun, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
The semiconductor device package includes a conformal shield layer applied to the exterior surface of the encapsulant, and an internal fence or separation structure embedded in the encapsulant. The fence separates the package into various compartments, with each compartment containing at least one die. The fence thus suppresses EMI between adjacent packages. The package further includes a ground path connected to the internal fence and conformal shield.