Company Filing History:
Years Active: 2018-2025
Title: Yuji Okita: Innovator in Substrate Processing Technology
Introduction
Yuji Okita is a prominent inventor based in Kyoto, Japan, known for his significant contributions to substrate processing technology. With a total of nine patents to his name, Okita has developed innovative solutions that enhance the efficiency and accuracy of substrate handling in various applications.
Latest Patents
Among his latest patents, Okita has developed a "Substrate Holder State Detection Device and Substrate Holder State Detection Method." This state detection device features at least one chuck pin for holding a substrate, a photographing unit to capture images of the chuck pin, and a matching coordinate calculation unit that performs matching processing between target and reference images. This technology allows for the precise detection of the open/closed state of the chuck pin, ensuring high detection accuracy. Another notable patent is the "Substrate Processing Apparatus and Substrate Processing Method," which includes a substrate holder, a cup member, an elevating mechanism, a first nozzle, and a camera. This apparatus is designed to hold and rotate substrates while efficiently applying processing liquids.
Career Highlights
Yuji Okita has made a significant impact in the field of substrate processing through his innovative designs and patents. His work has contributed to advancements in the efficiency and effectiveness of substrate handling, making him a key figure in this technological domain.
Collaborations
Okita has collaborated with notable colleagues, including Hiroaki Kakuma and Hideji Naohara, to further enhance the development of substrate processing technologies. Their combined expertise has led to the creation of advanced solutions that address industry challenges.
Conclusion
Yuji Okita's contributions to substrate processing technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of substrate handling and processing.
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