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For the Inventor, By the Inventor

Taichung, Taiwan

Yueh-Ching Pai

USPTO Granted Patents = 33 

Average Co-Inventor Count = 4.2

ph-index = 4

Forward Citations = 32(Granted Patents)


Location History:

  • New Taipei, TW (2022)
  • Taichung, TW (2019 - 2024)

Company Filing History:

goldMedal32 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 1 
 
Parabellum Strategic Oppurtunities Fund LLC
 patent

Years Active: 2019-2025

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33 patents (USPTO):
1. 12490508 - Semiconductor device and method (2025-12-02),
2. 12484291 - Semiconductor device and manufacturing method thereof (2025-11-25),
3. 12484257 - Method of forming gate structures for nanostructures (2025-11-25),
4. 12446255 - Semiconductor structure with source/drain multi-layer structure and method for forming the same (2025-10-14),
5. 12394624 - Silicon intermixing layer for blocking diffusion (2025-08-19),
6. 12382693 - Semiconductor device and methods of formation (2025-08-05),
7. 12191199 - Contact metallization process (2025-01-07),
8. 12170325 - Method of manufacturing a semiconductor device and a semiconductor device (2024-12-17),
9. 12170202 - Formation and in-situ etching processes for metal layers (2024-12-17),
10. 12166126 - Gate structure and semiconductor device having the same (2024-12-10),
11. 12068197 - Methods for forming contact plugs with reduced corrosion (2024-08-20),
12. 11990550 - Semiconductor structure with source/drain multi-layer structure and method for forming the same (2024-05-21),
13. 11973124 - Method of manufacturing a semiconductor device and a semiconductor device (2024-04-30),
14. 11742404 - Method of manufacturing a semiconductor device and a semiconductor device (2023-08-29),
15. 11587791 - Silicon intermixing layer for blocking diffusion (2023-02-21),

Title: The Innovative Journey of Inventor Yueh-Ching Pai

Introduction:

Inventor Yueh-Ching Pai, hailing from Taichung, Taiwan, is a visionary inventor known for his passion for innovation and relentless pursuit of excellence. With a track record of 21 patents, his contributions to the world of technology continue to inspire future generations of inventors and shape the landscape of innovation.

Latest Patents:

Yueh-Ching Pai's latest patents showcase his expertise in semiconductor device manufacturing. Innovations include a method of manufacturing a semiconductor device involving the formation of source/drain epitaxial layers, dielectric layers, silicide layers, and source/drain contacts. Another patent focuses on forming gate spaces, dielectric layers, conductive layers, and contact metal layers without the use of tungsten.

Career Highlights:

Yueh-Ching Pai's career is marked by groundbreaking achievements at Taiwan Semiconductor Manufacturing Company Limited (TSMC). His innovative spirit and technical prowess have significantly influenced the company's technological advancements in the semiconductor industry.

Collaborations:

Throughout his career, Yueh-Ching Pai has collaborated with esteemed coworkers such as Chun-Chieh Wang and Huai-Tei Yang. These collaborations have resulted in synergistic efforts that have led to the successful development and implementation of cutting-edge technologies.

Conclusion:

Inventor Yueh-Ching Pai's unwavering dedication to innovation and his remarkable achievements in semiconductor device manufacturing exemplify his status as a visionary inventor. His legacy serves as a beacon for aspiring inventors, inspiring them to push the boundaries of technology and drive forward the future of innovation.

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