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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Yu-Pin Tsai

This inventor holds 17 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2004-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Pin Tsai. Retrieved from https://idiyas.com/inventor/yu-pin-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 102(Granted Patents)


Location History:

  • Kaoshiung, TW (2004)
  • Kaohsiung, TW (2009 - 2024)

Company Filing History:

goldMedal17 out of 1,968 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2004-2025

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Areas of Expertise:
Semiconductor Package
Optical Device
Chip Carrier
Wafer Protection
Stacked Structure
Die Fabrication
Manufacturing Method
Semiconductor Process
Wafer Cassette
Chip Packaging
Device Package
17 patents (USPTO):Explore Patents
1. 12506103 - Semiconductor package structure and method of manufacturing the same (2025-12-23),
2. 11935841 - Semiconductor package structure and method for manufacturing the same (2024-03-19),
3. 11764311 - Optical device and electronic device (2023-09-19),
4. 11508668 - Semiconductor package structure and method for manufacturing the same (2022-11-22),
5. 11133423 - Optical device and method of manufacturing the same (2021-09-28),
6. 11121111 - Semiconductor package structure and method of manufacturing the same (2021-09-14),
7. 11088057 - Semiconductor package structure and method for manufacturing the same (2021-08-10),
8. 10879215 - Method for manufacturing a semiconductor device package (2020-12-29),
9. 10395997 - Semiconductor process (2019-08-27),
10. 10269771 - Semiconductor device package and a method of manufacturing the same (2019-04-23),
11. 10037975 - Semiconductor device package and a method of manufacturing the same (2018-07-31),
12. 9564376 - Semiconductor process (2017-02-07),
13. 8728915 - Wafer laser-making method and die fabricated using the same (2014-05-20),
14. 7842597 - Chip package, chip packaging, chip carrier and process thereof (2010-11-30),
15. 7560818 - Stacked structure of chips and water structure for making the same (2009-07-14),

Title: The Innovative Journey of Inventor Yu-Pin Tsai

Introduction: Yu-Pin Tsai, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Tsai's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a novel medical device aimed at improving patient care and outcomes.

Career Highlights: With a career spanning over two decades, Tsai has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them. His work has garnered international recognition and praise for its ingenuity and practicality.

Collaborations: Throughout his career, Tsai has collaborated with leading technology companies, research institutions, and universities to further enhance his inventions and bring them to market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: In conclusion, Yu-Pin Tsai's relentless pursuit of innovation and his passion for creating solutions that improve lives have solidified his reputation as a trailblazing inventor in the technology industry. His continued dedication to pushing the boundaries of what is possible ensures that his legacy will endure for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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