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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10269771 B1

PDFFull Text
Date of Patent:
Apr. 23, 2019

Filed:

Aug. 11, 2017

Semiconductor device package and a method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Li-Hao Lyu, Kaohsiung, TW;

Chieh-Ju Tsai, Kaohsiung, TW;

Yu-Kai Lin, Kaohsiung, TW;

Wei-Ming Hsieh, Kaohsiung, TW;

Yu-Pin Tsai, Kaohsiung, TW;

Man-Wen Tseng, Kaohsiung, TW;

Yu-Ting Lu, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/427 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/561 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/427 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.

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