Company Filing History:
Years Active: 2019-2020
Title: Innovations of Li-Hao Lyu in Semiconductor Technology
Introduction
Li-Hao Lyu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to manufacturing semiconductor device packages. His work is instrumental in advancing the efficiency and effectiveness of semiconductor devices.
Latest Patents
Li-Hao Lyu's latest patents include a method for manufacturing a semiconductor device package. This method involves several key steps: providing a first encapsulation layer, disposing an adhesive layer on the first encapsulation layer, placing a first die on the adhesive layer, and forming a second encapsulation layer that covers the first die, the adhesive layer, and the first encapsulation layer. Another notable patent is for a semiconductor device package itself, which comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating both the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer features a first surface and a second surface that differ in their contact angles, enhancing the functionality of the device.
Career Highlights
Li-Hao Lyu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate and develop new technologies in semiconductor manufacturing. His expertise and dedication to his work have positioned him as a valuable asset in the industry.
Collaborations
Li-Hao has collaborated with talented coworkers, including Chieh-Ju Tsai and Yu-Kai Lin, who contribute to the dynamic environment of innovation at Advanced Semiconductor Engineering, Inc.
Conclusion
Li-Hao Lyu's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the field. His advancements are paving the way for future developments in semiconductor devices.