Advanced Semiconductor Engineering, Inc.

Li-Hao Lyu

Yu-Pin Tsai

Yu-Ting Lu

Yu-Kai Lin

Man-Wen Tseng

Wei-Ming Hsieh

Chieh-Ju Tsai

A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

Method for manufacturing a semiconductor device package

A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.

Semiconductor device package and a method of manufacturing the same

Growing community of inventors

Kaohsiung, Taiwan

Li-Hao Lyu