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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10879215 B1

PDFFull Text
Date of Patent:
Dec. 29, 2020

Filed:

Mar. 08, 2019

Method for manufacturing a semiconductor device package

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Li-Hao Lyu, Kaohsiung, TW;

Chieh-Ju Tsai, Kaohsiung, TW;

Yu-Kai Lin, Kaohsiung, TW;

Wei-Ming Hsieh, Kaohsiung, TW;

Yu-Pin Tsai, Kaohsiung, TW;

Man-Wen Tseng, Kaohsiung, TW;

Yu-Ting Lu, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/427 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/561 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/427 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A method for manufacturing a semiconductor device package includes: (1) providing a first encapsulation layer; (2) disposing an adhesive layer on the first encapsulation layer; (3) disposing a first die on the adhesive layer; and (4) forming a second encapsulation layer covering the first die, the adhesive layer, and the first encapsulation layer.

Find Patent Forward Citations

Lyu, Li-Hao. (2020). Method for manufacturing a semiconductor device package (U.S. Patent No. 10879215). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10879215

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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