Company Filing History:
Years Active: 2018-2020
Title: Innovations by Wei-Ming Hsieh in Semiconductor Device Packaging
Introduction: Wei-Ming Hsieh is a notable inventor based in Kaohsiung, Taiwan, recognized for his contributions to the field of semiconductor device packaging. With three patents to his name, Hsieh has actively advanced technology in this domain, showcasing his expertise and innovative spirit in semiconductor manufacturing.
Latest Patents: Wei-Ming Hsieh's latest patents include a novel method for manufacturing a semiconductor device package. This method involves several key steps: providing a first encapsulation layer, disposing an adhesive layer on this first encapsulation layer, placing a first die on the adhesive layer, and forming a second encapsulation layer that covers both the first die and the adhesive layer. Another significant patent details a semiconductor device package itself, which includes an adhesive layer, a die positioned on this layer, and both a first and a second encapsulation layer. Remarkably, the second encapsulation layer has distinct contact angles on its two surfaces, allowing for enhanced performance and efficiency in semiconductor applications.
Career Highlights: Wei-Ming Hsieh currently works at Advanced Semiconductor Engineering, Inc., where he applies his innovative ideas to real-world manufacturing processes. His role at the company places him at the forefront of semiconductor technology, driving advancements that contribute to the overall progress in the industry.
Collaborations: Throughout his career, Hsieh has collaborated with skilled professionals such as Yu-Pin Tsai and Man-Wen Tseng. These partnerships have enabled the exchange of ideas and fostered an environment in which innovation can thrive, ultimately leading to the successful development of Hsieh's patents.
Conclusion: Wei-Ming Hsieh's work in semiconductor device packaging exemplifies the spirit of innovation that is crucial for ongoing advancements in technology. With a solid portfolio of patents and a collaborative approach, Hsieh continues to make meaningful contributions to the semiconductor industry, paving the way for future innovations.