The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2009

Filed:

Jul. 24, 2007
Applicant:

Yu-pin Tsai, Kaohsiung, TW;

Inventor:

Yu-Pin Tsai, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stacked structure of chips including a first chip, a second chip, an insulation layer and a first conductive element is provided. The second chip is attached to the first chip, and the back surface of the second chip faces an active surface of the first chip. The second chip includes a first contact disposed on an active surface of the second chip. The insulation layer disposed on the active surface of the first chip encapsulates the second chip. The first conductive element is formed in the insulation layer for electrically connecting one end of the first conductive element to the first contact and the other end of the first conductive element exposed outside the insulation layer. A wafer structure for making the stacked structure of chips is also provided. The stacked structure of chips has no circuit carrier, hence reducing the thickness of the stacked structure.


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