The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2010
Filed:
Sep. 27, 2005
Yu-pin Tsai, Kaohsiung, TW;
Yu-Pin Tsai, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A chip package includes a semiconductor substrate, conductive plugs and a chip. Wherein, the conductive plugs perforate the semiconductor substrate. Besides, the chip is disposed on a surface of the semiconductor substrate and electrically connected to the conductive plugs. Based on the above-described design, the chip package is capable of reducing the thermal stress problem caused by a coefficient of thermal expansion (CTE) dismatch compared with the prior art. The present invention discloses further a chip packaging process and furthermore a chip carrier and the process thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile