The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2014
Filed:
Sep. 06, 2011
Yu-pin Tsai, Kaohsiung, TW;
Cheng-i Huang, Hunei Township, Kaohsiung County, TW;
Yao-hui HU, Dashe Township, Kaohsiung County, TW;
Yu-Pin Tsai, Kaohsiung, TW;
Cheng-I Huang, Hunei Township, Kaohsiung County, TW;
Yao-Hui Hu, Dashe Township, Kaohsiung County, TW;
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Abstract
A wafer laser-marking method is provided. First, a wafer having a first surface (an active surface) and a second surface (a back surface) opposite to each other is provided. Next, the wafer is thinned. Then, the thinned wafer is fixed on a non-UV tape such that the second surface of the wafer is attached to the tape. Finally, the laser marking step is performed, such that a laser light penetrates the non-UV tape and marks a pattern on the second surface of the wafer. According to the laser-marking method of the embodiment, the pattern is formed by the non-UV residuals left on the second surface of the wafer, and the components of the glue residuals at least include elements of silicon and carbon.