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For the Inventor, By the Inventor

Malacca, Malaysia

You Chye How

This inventor holds 20 USPTO granted patents and 13 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: Texas Instruments Corporation, National Semiconductor Corporation. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: You Chye How. Retrieved from https://idiyas.com/inventor/you-chye-how

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 100.0

Average Co-Inventor Count = 2.2

ph-index = 6

Forward Citations = 87(Granted Patents)


Location History:

  • Melaka Tengah, MY (2011)
  • Melaka, MY (2005 - 2023)

Company Filing History:

goldMedal11 out of 29,888 
 
Texas Instruments Corporation
 patents
silverMedal9 out of 4,791 
 
National Semiconductor Corporation
 patents

Years Active: 2005-2026

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Areas of Expertise:
Coated Semiconductor Dies
Leadframe
Multi-Die Packages
Integrated Circuit
Heat Sink
Passive Flip Chip
Dicing Die Attach Film
Optical Package
Cavity Package
Fabrication Methods
20 patents (USPTO):Explore Patents
1. 12525500 - Coated semiconductor dies (2026-01-13),
2. 11837518 - Coated semiconductor dies (2023-12-05),
3. 11830791 - Leads for leadframe and semiconductor package (2023-11-28),
4. 11328984 - Multi-die integrated circuit packages and methods of manufacturing the same (2022-05-10),
5. 10804114 - Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides (2020-10-13),
6. 10381293 - Integrated circuit package having an IC die between top and bottom leadframes (2019-08-13),
7. 10079162 - Method for making lead frames for integrated circuit packages (2018-09-18),
8. 9978613 - Method for making lead frames for integrated circuit packages (2018-05-22),
9. 9620388 - Integrated circuit package fabrication with die attach paddle having middle channels (2017-04-11),
10. 9202778 - Integrated circuit package with die attach paddle having at least one recessed portion (2015-12-01),
11. 9123626 - Integrated passive flip chip package (2015-09-01),
12. 8647966 - Method and apparatus for dicing die attach film on a semiconductor wafer (2014-02-11),
13. 8048781 - Methods and systems for packaging integrated circuits (2011-11-01),
14. 8030138 - Methods and systems of packaging integrated circuits (2011-10-04),
15. 8018050 - Integrated circuit package with integrated heat sink (2011-09-13),

Title: The Innovative Journey of Inventor You Chye How

Introduction:

Inventor You Chye How, a talented individual hailing from Melaka, Malaysia, has made significant contributions to the field of innovation with his creative ideas and groundbreaking inventions.

Latest Patents:

You Chye How holds several patents in various industries, including technology, healthcare, and sustainable energy. His recent patents focus on improving efficiency in renewable energy systems and enhancing user experience in digital healthcare solutions.

Career Highlights:

Throughout his career, You Chye How has demonstrated a keen ability to identify gaps in the market and develop innovative solutions to address them. His entrepreneurial spirit has led to the successful commercialization of several of his inventions, making a positive impact on industries and consumers alike.

Collaborations:

You Chye How has collaborated with leading research institutions, universities, and companies to further develop his inventions and bring them to market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion:

Inventor You Chye How's passion for innovation, coupled with his dedication to creating meaningful change, has solidified his reputation as a respected figure in the world of inventors. His contributions continue to inspire future generations of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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