The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Mar. 07, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventor:
You Chye How, Melaka, MY;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); H01L 2221/68372 (2013.01);
Abstract
Disclosed examples include a method of making a semiconductor die package comprising arranging at least one preformed die attach pad and at least two preformed leads on a lead frame carrier in a predetermined configuration to form a lead frame, attaching a semiconductor die to the at least one preformed die attach pad, wire bonding the semiconductor die to the at least two preformed leads, forming a molding structure including at least part of the semiconductor die and the at least two preformed leads, and removing the molding structure from the lead frame carrier.