The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Aug. 26, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Michael Todd Wyant, Dallas, TX (US);
Matthew John Sherbin, Dallas, TX (US);
Christopher Daniel Manack, Flower Mound, TX (US);
Patrick Francis Thompson, Allen, TX (US);
You Chye How, Melaka, MY;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3185 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 23/3171 (2013.01); H01L 23/552 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68336 (2013.01);
Abstract
In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.