Michael Todd Wyant

This inventor holds 16 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Todd Wyant. Retrieved from https://idiyas.com/inventor/michael-todd-wyant

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 16 (Patent Applications = 13)

% Patents Active = 81.3

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 5(Granted Patents)

Company Filing History:

16 out of 29,922

Texas Instruments Corporation

patents

Years Active: 2014-2026

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Areas of Expertise:

Integrated Circuit

Semiconductor Dies

Laser Ablation

Wafer Dicing

Die Separation

Crack Reduction

Coated Dies

Stacked Package

Hyperbaric Saw

Leadframe

Scribe Seal

Subring

16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12777945 - Integrated circuit having improved ASML alignment marks (2026-10-27),

2. 12685060 - Methods of separating semiconductor dies (2026-07-14),

3. 12648445 - Semiconductor device and process with crack reduction (2026-06-02),

4. 12525500 - Coated semiconductor dies (2026-01-13),

5. 12512416 - Laser ablation for die separation to reduce laser splash and electronic device (2025-12-30),

6. 12394671 - Efficient removal of street test devices during wafer dicing (2025-08-19),

7. 12198982 - Laser dicing for singulation (2025-01-14),

8. 12009319 - Integrated circuit with metal stop ring outside the scribe seal (2024-06-11),

9. 11837518 - Coated semiconductor dies (2023-12-05),

10. 11676829 - Hyperbaric saw for sawing packaged devices (2023-06-13),

11. 11664276 - Front side laser-based wafer dicing (2023-05-30),

12. 11482442 - Subring for semiconductor dies (2022-10-25),

13. 11469141 - Laser dicing for singulation (2022-10-11),

14. 11171031 - Die matrix expander with partitioned subring (2021-11-09),

15. 10840211 - Semiconductor package with leadframe having pre-singulated leads or lead terminals (2020-11-17),

Title: Michael Todd Wyant: Innovator in Semiconductor Technology

Introduction

Michael Todd Wyant is a prominent inventor based in Dallas, TX, known for his significant contributions to semiconductor technology. With a total of 16 patents to his name, Wyant has made remarkable advancements in the field, particularly in the manufacturing processes of semiconductor packages.

Latest Patents

Wyant's latest patents include innovative methods for efficient removal of street test devices during wafer dicing. This method involves coupling a photoresist layer to a semiconductor wafer and performing a photolithographic process to create openings for plasma etching. Another notable patent focuses on laser dicing for singulation, where a laser beam is used to ablate metal layers in scribe streets, allowing for the precise separation of semiconductor device dies.

Career Highlights

Wyant is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Throughout his career, Wyant has collaborated with notable colleagues, including Matthew John Sherbin and Shoichi Iriguchi, contributing to various innovative projects within the semiconductor field.

Conclusion

Michael Todd Wyant's contributions to semiconductor technology through his patents and work at Texas Instruments Corporation highlight his role as a key innovator in the industry. His advancements continue to shape the future of semiconductor manufacturing.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

13 patents pending: