The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

Jul. 31, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Jaimal Mallory Willamson, McKinney, TX (US);

Michael Todd Wyant, Dallas, TX (US);

Yutaka Suzuki, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81815 (2013.01);
Abstract

An example device includes: a semiconductor die formed on a semiconductor substrate and having a device side surface, a backside surface opposite the device side surface, and having sides between the device side surface and the backside surface at edges of the semiconductor die; the semiconductor die having a device area comprising electrical devices formed on the semiconductor die, and having a scribe spacing area between the device area and the edges of the semiconductor die; the semiconductor die having polymeric anchors in the scribe spacing area, the polymeric anchors being recesses that extend through a protective overcoat dielectric layer that is over the device side surface of the semiconductor die, and extending into the semiconductor substrate of the semiconductor die; and polymeric material covering at least a portion of the semiconductor die, the polymeric material filling the recesses of the polymeric anchors.


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