The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Jul. 17, 2019
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
You Chye How, Melaka, MY;
Anis Fauzi Bin Abdul Aziz, Kedah, MY;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/50 (2006.01); H02H 5/04 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 21/50 (2013.01); H01L 23/49534 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49555 (2013.01); H01L 23/49558 (2013.01); H01L 23/49582 (2013.01); H02H 5/042 (2013.01); H02H 5/047 (2013.01); H01L 2021/60015 (2013.01);
Abstract
A semiconductor package includes a die pad and leads extending from the die pad. Each lead has a free end with outer surfaces extending at angles from one another. An electrically conductive plating material covers at least portions of the outer surfaces. A die attached to the die pad is electrically connected to the leads. An insulating layer extends over the leads and the die such that the free ends of the leads are exposed.