The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Feb. 27, 2014
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/40 (2006.01); H01L 21/00 (2006.01); H01L 25/16 (2006.01); H01L 23/495 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/165 (2013.01); H01L 21/565 (2013.01); H01L 21/768 (2013.01); H01L 21/76898 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/528 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/0534 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/14 (2013.01);
Abstract
A method for packaging integrated circuit die such that each package includes die with integrated passive components mounted to either the back surface, the active surface or both the back and active surfaces of the die.