IDiyas

For the Inventor, By the Inventor

San Jose, CA, United States of America

Yi-Sheng Anthony Sun

USPTO Granted Patents = 12

Average Co-Inventor Count = 4.5

ph-index = 4

Forward Citations = 78(Granted Patents)


Company Filing History:

goldMedal11 out of 1,284 
 
Maxim Integrated Products, Inc.
 patents
silverMedal1 out of 48 
 
United Test and Assembly Center Limited
 patents

Years Active: 2013-2022

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12 patents (USPTO):
1. 11380558 - Optical sensor packaging system (2022-07-05),
2. 10727086 - Optical sensor packaging system (2020-07-28),
3. 9583425 - Solder fatigue arrest for wafer level package (2017-02-28),
4. 9425160 - Wafer-level package device with solder bump reinforcement (2016-08-23),
5. 9397027 - Sacrificial pad on semiconductor package device and method (2016-07-19),
6. 9343430 - Stacked wafer-level package device (2016-05-17),
7. 9093333 - Integrated circuit device having extended under ball metallization (2015-07-28),
8. 9087732 - Wafer-level package device having solder bump assemblies that include an inner pillar structure (2015-07-21),
9. 8686543 - 3D chip package with shielded structures (2014-04-01),
10. 8647924 - Semiconductor package and method of packaging semiconductor devices (2014-02-11),
11. 8643150 - Wafer-level package device having solder bump assemblies that include an inner pillar structure (2014-02-04),
12. 8575493 - Integrated circuit device having extended under ball metallization (2013-11-05),

Title: **Innovator Spotlight: Yi-Sheng Anthony Sun**

Introduction

Yi-Sheng Anthony Sun is an accomplished inventor based in San Jose, California. With a remarkable portfolio of 12 patents, he has significantly contributed to the field of optical sensor technology. His innovative approaches have paved the way for advancements in sensor packaging systems, showcasing his expertise and creativity.

Latest Patents

Among his latest inventions are two notable patents related to optical sensor packaging systems. The first patent describes a sophisticated system that involves providing a substrate with a redistribution pad, mounting an optical sensor equipped with a photo-sensitive material, and encapsulating the entire assembly with an over-mold. This over-mold features a top surface coplanar to the photo-sensitive material and creates a vertically extended border around it.

The second patent expands on this technology by utilizing an embedded substrate that encompasses an embedded chip. Similar to the first, it focuses on wire-bonding an optical sensor and encapsulating the assembly with a precisely designed over-mold. Both patents reflect Yi-Sheng's commitment to enhancing the integration and performance of optical sensors.

Career Highlights

Yi-Sheng Anthony Sun has made significant strides in his career, working with renowned companies like Maxim Integrated Products, Inc. and United Test and Assembly Center Limited. His experience in these leading organizations has allowed him to hone his skills further and contribute to cutting-edge research and development in optical sensors.

Collaborations

Throughout his career, Yi-Sheng has collaborated with several talented individuals, including Yong L. Xu and Arkadii V. Samoilov. These partnerships have fostered a rich environment of innovation, leading to the development of advanced technologies in the sensor domain.

Conclusion

Yi-Sheng Anthony Sun stands out as a visionary inventor in the realm of optical sensor technology. With a strong portfolio of patents and collaborations, his work continues to influence innovations in packaging systems. As technology advances, Yi-Sheng's contributions will undoubtedly play a vital role in shaping the future of optical sensing applications.

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