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For the Inventor, By the Inventor

Tsukuba, Japan

Yasushi Shimada

USPTO Granted Patents = 16

Average Co-Inventor Count = 7.8

ph-index = 8

Forward Citations = 210(Granted Patents)


Company Filing History:

goldMedal15 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents
silverMedal2 out of 42,485 
 
Hitachi, Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1993-2012

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16 patents (USPTO):
1. 8119737 - Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device (2012-02-21),
2. 7947779 - Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer (2011-05-24),
3. 7700185 - Insulation material, film, circuit board and method of producing them (2010-04-20),
4. 7592250 - Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device (2009-09-22),
5. 7239013 - Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device (2007-07-03),
6. 7070670 - Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device (2006-07-04),
7. 6889431 - Manufacturing method of electronic circuit including multilayer circuit board (2005-05-10),
8. 6838170 - Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same (2005-01-04),
9. 6673441 - Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same (2004-01-06),
10. 6621170 - Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film (2003-09-16),
11. 6265782 - Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film (2001-07-24),
12. 6184577 - Electronic component parts device (2001-02-06),
13. 6090468 - Multilayer wiring board for mounting semiconductor device and method of (2000-07-18),
14. 5965269 - Adhesive, adhesive film and adhesive-backed metal foil (1999-10-12),
15. 5323534 - Process for producing coaxial conductor interconnection wiring board (1994-06-28),

Title: Innovations of Yasushi Shimada

Introduction

Yasushi Shimada is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of adhesive compositions, particularly in applications related to semiconductors. With a total of 16 patents to his name, Shimada's work has had a considerable impact on the industry.

Latest Patents

Shimada's latest patents include an innovative adhesive composition that consists of an epoxy resin, a curing agent, and a polymer compound that is incompatible with the epoxy resin. This composition may also include optional components such as fillers and curing accelerators. The patents detail a process for producing this adhesive composition, which involves mixing the epoxy resin and curing agent with fillers, followed by the addition of the incompatible polymer compound. Additionally, he has developed an adhesive film made from this composition, which is designed for use in semiconductor mounting applications. His work also encompasses a semiconductor device that utilizes this adhesive film or substrate for mounting semiconductors.

Career Highlights

Throughout his career, Yasushi Shimada has worked with notable companies such as Hitachi Chemical Company, Ltd. and Hitachi, Ltd. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and semiconductor applications.

Collaborations

Shimada has collaborated with several professionals in his field, including Kazunori Yamamoto and Hiroyuki Kuriya. These collaborations have contributed to the advancement of adhesive technologies and their applications in various industries.

Conclusion

Yasushi Shimada's innovative work in adhesive compositions and semiconductor applications has established him as a key figure in his field. His numerous patents reflect his dedication to advancing technology and improving industry standards.

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